The unique MPI Laser Cutter System LCS-635 is designed for accurate and reliable Failure Analysis and Design Validation applications. Variable configurations based on 1064 nm, 532 nm, 355 nm or 266 nm wavelengths provides the capability to remove several semiconductor materials and metals selectively, see below the table.
Features & Benefits
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High Beam Quality – Low Energy ConsumptionThe MPI Laser Cutter System is based on compact Diode Pump Solid State Laser, providing high beam quality, even at 266 nm, with enhanced pulse-to-pulse stability, and these by the unsurpassed low energy consumption.
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Long Lifetime – Low MaintenanceThe LCS-635 has more than 150x times longer lifetime as other conventional available laser systems on the market, and the passive, conductive laser head cooling, which eliminates the need for water, are making the system very reliable and reducing significantly the maintenance costs.
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Intuitive OperationDesigning the SMART Controller with intuitive, touch-screen graphical user interface, four free-defined function buttons for fast, direct access, the six user cutting recipes, are making the daily operation of the Laser Cutter System very convenient and easy.
Wavelength – Application Matrix
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1064 nm532 nm355 / 266 nm
LCD Materials ITO
Chromium
Color Filter
(Red / Green)ITO
Chromium
Color Filter
(Blue / Green)Color Filter
(Blue / Green)Semiconductor Materials N/A Silicon Dioxide
Nitride Polyimide (big cuts)
SOG Poly-siliconNitride
PolyimideMetals Gold
Aluminum
TungstenGold
Aluminum
TungstenGold
Aluminum
MPI Optics – Application Matrix
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Microscope*1064 nm532 nm355 nm266 nm
FS70L Yes Yes Yes Not Recommended FS70L4 Not Recommended Yes Yes Yes PSM1000 Yes Yes Yes Not Recommended VIS-200 Yes Not Recommended Not Recommended Not Recommended
* Other laser cutter compatible microscopes, on requests